한국복합재료학회:학술대회논문집 (Proceedings of the Korean Society For Composite Materials Conference)
- 한국복합재료학회 2002년도 추계학술발표대회 논문집
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- Pages.261-264
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- 2002
Electro-Micromechanical 시험법을 이용한 탄소섬유 강화 Epoxyacrylate 복합재료의 UV 및 열경화에 따른 비파괴적 손상 감지능 및 경화 Monitoring
Nondestructive Damage Sensing and Cure Monitoring of Carbon Fiber/Epoxyacrylate Composite with UV and Thermal Curing using Electro-Micromechanical Technique
- Kong, Jin-Woo (Department of Polymer Science and Engineering, Engineering Research Institute Gyeongsang National University) ;
- Kim, Dae-Sik (Department of Polymer Science and Engineering, Engineering Research Institute Gyeongsang National University) ;
- Park, Joung-Man (Department of Polymer Science and Engineering, Engineering Research Institute Gyeongsang National University) ;
- Lee, Jae-Rock (Advanced Materials Division, Korea Research Institute of Chemical Technology)
- 발행 : 2002.10.01
초록
Interfacial evaluation, damage sensing and cure monitoring of single carbon fiber/thermosetting composite with different curing processes was investigated using electro-micromechanical test. After curing, residual stress was monitored by measurement of electrical resistance (ER) and then it was compared to correlate with various curing processes. In thermal curing, curing shrinkage appeared significantly by matrix shrinkage and residual stress due to the difference in thermal expansion coefficient (TEC). The change in electrical resistance (ΔR) on thermal curing was higher than that on ultraviolet (UV) curing. For thermal curing, apparent modulus was the highest and reaching time until same strain was faster. So far thermal curing shows strong durability on the IFSS after boiling test.
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