Proceedings of the Korean Society For Composite Materials Conference (한국복합재료학회:학술대회논문집)

The Korean Society for Composite Materials (한국복합재료학회)
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Interfacial Evaluation and Damage Sensing of Carbon Fiber/Epoxy-AT-PEI Composite using Electro-Micromechanical Techniques

Electro-micromechanical 시험법을 이용한 탄소섬유 강화 Epoxy-AT PEI 복합재료의 손상 감지능 및 계면물성 평가

  • Kim, Dae-Sik (Department of Polymer Science and Engineering, Research Center for Aircraft Parts Technology, Gyeongsang National University) ;
  • Kong, Jin-Woo (Department of Polymer Science and Engineering, Research Center for Aircraft Parts Technology, Gyeongsang National University) ;
  • Park, Joung-Man (Department of Polymer Science and Engineering, Research Center for Aircraft Parts Technology, Gyeongsang National University) ;
  • Kim, Minyoung (Department of Chemical Engineering, Pusan National University) ;
  • Kim, Wonho (Department of Chemical Engineering, Pusan National University) ;
  • Ahn, Byung-Hyun (Department of Materials Science and Engineering, Pukyong National University) ;
  • Park, Jin-Ho (School of Transport Vehicle Engineering, Gyeongsang National University)
  • Published : 2002.10.01
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Abstract

Interfacial evaluation and damage sensing of the carbon fiber/epoxy-amine terminated (AT)-polyetherimide (PEI) composites were performed using micromechanical test and electrical resistance measurement. As AT-PEI content increased, the fracture toughness of epoxy-AT-PEI matrix increased, and thus their interfacial shear strength (IFSS) was improved due to the improved toughness. After curing process, the changes in electrical resistance (ΔR) with increasing AT-PEI contents increased gradually because of the changes in thermal expansion coefficient (TEC) and thermal shrinkage of matrix. Matrix fracture toughness was correlated to the IFSS, residual stress and electrical resistance. The results obtained from the electrical resistance measurement during curing process, reversible stress/strain, and durability test were consistent with modified matrix toughness properties.

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