전자 패키징용 금속복합재료의 온도에 따른 열팽창 특성

Analysis of Temperature dependent Thermal Expansion Behavior in MMCs for Electronic packaging

This study developed SiC/Al composites for electronic packaging to which reinforcements were added with the volume fractions of 49%, 56% and 63% by the squeeze casting method. 0.8 wt.% of the inorganic binder as well as the $Al_2O_3$ fiber and SiC particles with the volume fraction of 1:10 were added to the SiC/Al composites For the produced SiC/Al composites, the CTEs (coefficients of thermal expansion) were measured from 30 to $300^{\circ}C$ and compared with the FEM numerical simulation to analyze the temperature dependent properties. The experiment showed the CTEs of SiC/Al composites that were intermediate values of those of Rule of Mixture and Turner's Model. The CTEs were close to Turner's Model in the room temperature and approached the Rule of Mixture as the temperature increases. These properties analyzed from the difference of the average stress acting between the matrix and the reinforcements proposed in this study