대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)
- 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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- Pages.456-462
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- 2002
FLIP CHIP SOLDER BUMPING PROCESS BY ELECTROLESS NI
- Lee, Chang-Youl (School of metallurgical and Materials Engineering, SungKyunKwan University) ;
- Cho, Won-Jong (School of metallurgical and Materials Engineering, SungKyunKwan University) ;
- Jung, Seung-Boo (School of metallurgical and Materials Engineering, SungKyunKwan University) ;
- Shur, Chang-Chae (School of metallurgical and Materials Engineering, SungKyunKwan University)
- 발행 : 2002.10.01
초록
In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni