자장감쇄법을 이용한 Bi-2223/Ag 선재의 접합저항 측정 평가

Measurement of joint resistance of Bi-2223/Ag tapes using field decay technique

Considering the application of high temperature superconductor to MRI, the loss at conductor joint would be very important. Therefore, we have carried out a measurement of joint resistance of Bi-2223/Ag tapes at 77 K. A pancake coil was wound by Bi-2223/Ag tape. Both ends the tape were overlapped and soldered to each other. The DC current is induced in the pancake coil by energizing the excitation coil wound by copper wire closely located to the pancake coil. The decay behaviour of the current in coils was clearly separated in two regimes, and initial fast decay of the order of minutes followed by a slow logarithmic-like decay, From this data, the resistance of the joint was evaluated as 2.74 n$\Omega$.