High Temperature Crystallized Poly-Si on the Molybdenum Substrate for Thin Film Transistor Applications

몰리브덴 기판 위에 고온 결정화된 다결정 실리콘 박막 트랜지스터 특성에 관한 연구

  • 박중현 (성균관대학교 정보통신공학부 신소재연구실) ;
  • 김도영 (성균관대학교 정보통신공학부 신소재연구실) ;
  • 고재경 (성균관대학교 정보통신공학부 신소재연구실) ;
  • 이준신 (성균관대학교 정보통신공학부 신소재연구실)
  • Published : 2002.07.01

Abstract

Polycrystalline silicon thin film transistors (poly-Si TFTs) are used in a wide variety of applications, and will figure prominently future high-resolution, high-performance flat panel display technology However, it was very difficult to fabricate high performance poly-Si TFTs at a temperature lower than 300$^{\circ}C$ for glass substrate. Conventional process on a glass substrate were limited temperature less than 600$^{\circ}C$ This paper proposes a high temperature process above 750$^{\circ}C$ using a flexible molybdenum substrate deposited hydrogenated amorphous silicon (a-Si:H) and than crystallized a rapid thermal processor (RTP) at the various temperatures from 750$^{\circ}C$ to 1050$^{\circ}C$. The high temperature annealed poly-Si film illustrated field effect mobility higher than 30 $\textrm{cm}^2$/Vs, achieved I$\sub$on//I$\sub$off/ current ratio of 10$^4$ and crystall volume fraction of 92%. In this paper, we introduce the new TFTs Process as flexible substrate very promising roll-to-roll process, and exhibit the properties of high temperature crystallized poly-Si Tn on molybdenum substrate.

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