Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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High Precision Embedded Capacitor Films for Build-Up Substrates Applications

  • Kyung W. Paik (KAIST Micro-Electronic Packagng Lab. (MEPL))
  • Published : 2002.03.01

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Abstract

1. New Embedded Capacitor Film with good electrical performance, easy processability and long shelf life was successfully developed. $.$dielectric constant 90, $.$leakage current < 10$\^$-7/A/$\textrm{cm}^2$, $.$tolerance ∼5%. 2. Dielectric constant was further increased by (i) Increasing the hig dielectric constant ceramics (ii) Improving the packing density by introducing a bimodal powder distribution.

Keywords