Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2002.07c
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- Pages.1536-1538
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- 2002
Effects of thermal treatment on structural and electrical properties of DLC films deposited by FCVA method
FCVA 방법으로 증착된 DLC 박막의 열처리에 따른 구조적, 전기적 물성 분석
- Kim, Young-Do (Dept. of Electronic, Electrical, Control and Instrumentation Engineering, Hanyang University) ;
- Chang, Seok-Mo (Dept. of Electronic, Electrical, Control and Instrumentation Engineering, Hanyang University) ;
- Park, Chang-Kyun (Dept. of Electronic, Electrical, Control and Instrumentation Engineering, Hanyang University) ;
- Uhm, Hyun-Seok (Dept. of Electronic, Electrical, Control and Instrumentation Engineering, Hanyang University) ;
- Park, Jin-Seok (Dept. of Electronic, Electrical, Control and Instrumentation Engineering, Hanyang University)
- 김영도 (한양대학교 전자전기제어계측공학과) ;
- 장석모 (한양대학교 전자전기제어계측공학과) ;
- 박창균 (한양대학교 전자전기제어계측공학과) ;
- 엄현석 (한양대학교 전자전기제어계측공학과) ;
- 박진석 (한양대학교 전자전기제어계측공학과)
- Published : 2002.07.10
Abstract
Effects at thermal treatment on the structural and electrical properties at DLC films have been studied. The DLC films were deposited by using a modified FCVA system as a function at negative substrate bias voltage, deposition time, and nitrogen flow rate. The thermal treatment on DLC films could be achieved by performing the RTA process at
Keywords