제어로봇시스템학회:학술대회논문집
- 2001.10a
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- Pages.131.3-131
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- 2001
A Study on Development of 3D Outsole Profile Scanner for Footwear Bonding Automation
- Lho, Tae-Jung (Tongmyong University of Information Technology) ;
- Park, Pil-Gyu (Tongmyong University of Information Technology) ;
- Suh, Jong-Chul (Tongmyong University of Information Technology) ;
- Park, Dong-Joo (Nanux Co.) ;
- Ahn, Hee-Tae (Inner Tech Co.)
- Published : 2001.10.01
Abstract
A 2-dimensional scanner have been generally used for an office, but 3-dimensional one was seldom used in industry. A footwear bonding process has been operated manually by the skilled operators, but it is needed to be operated automatically. So we developed an automatic outsole profile scanner, which consists of PC, CCD camera, laser beam diode and moving mechanism, to scan automatically the 3-dimensional profile of outsole inner face to be bonded. Here the developed algorithm makes 2D image into 3D outsole profile. This profile will be used enough to bond automatically the outsole to something like leather or clothes.
Keywords