A Study on the Diamond Wheel Wear in Ceramic Grinding

세라믹 연삭에서 다이아몬드 숫돌 마멸에 관한 연구

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel grinding ceramic materials. Normal component of grinding resistance was decreasing while increase of spindle speed. The resistance of vitrified bond wheel was less then that of resinoid bond wheel because of imbedded large holes on the surface of cutting edge. Surface roughness was decreasing while increase of spindle speed. The surface roughness after using vitrified bond wheel was less than that of resinoid bond wheel because of small elastic deformation. After continuous grinding of ceramics, cutting edge ratio of resinoid bond wheel decreases. For the case of vitrified bond wheel, cutting edge ratio does not change.