Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference (한국펄프종이공학회:학술대회논문집)
- 2001.11a
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- Pages.60-66
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- 2001
Mechanism of Bonding Strength Enhancement by Bonding Agents: Effect of Conductivity on the Tensile Strength of Paper
- Kim, Eunyoung (Kangwon National University) ;
- Hiroki Nanko (Institute of Paper Science and Technology) ;
- Yoon, Byung-Ho (Kangwon National University)
- Published : 2001.11.01
Abstract
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