Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2001.07a
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- Pages.161-164
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- 2001
A Study on the Solderability of Sn-Ag Alloy that contains In, Bi
In, Bi를 함유한 Sn-Ag계 무연솔더의 솔더링성 연구
Abstract
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