한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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- Pages.49-54
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- 2001
플립칩용 UBM (Under Bump Metallurgy)연구의 최근동향
Recent UBM (Under Bump Metallurgy) Studies for Flip Chip Application
- Jang, Se-Young (Dept. of Materials Science and Engineering, KAIST) ;
- Paik, Kyung-Wook (Dept. of Materials Science and Engineering, KAIST)
- 발행 : 2001.11.01
초록
This paper presents several UBM (Under Bump Metallurgy) systems which are currently used for wafer level solder bumping technology. The advantages and disadvantages of each UBM are summarized from the point of view of process compatability and interface morphological stability.
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