Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2001.11a
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- Pages.49-54
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- 2001
Recent UBM (Under Bump Metallurgy) Studies for Flip Chip Application
플립칩용 UBM (Under Bump Metallurgy)연구의 최근동향
- Jang, Se-Young (Dept. of Materials Science and Engineering, KAIST) ;
- Paik, Kyung-Wook (Dept. of Materials Science and Engineering, KAIST)
- Published : 2001.11.01
Abstract
This paper presents several UBM (Under Bump Metallurgy) systems which are currently used for wafer level solder bumping technology. The advantages and disadvantages of each UBM are summarized from the point of view of process compatability and interface morphological stability.
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