Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 2001.05a
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- Pages.77-77
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- 2001
A New Technique for Monitoring Metallization Reliability at Wafer (Breakdown Current of Metal : BCM)
금속배선의 신뢰성을 monitoring하는 새로운 기술
Abstract
Keywords