Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2001.07a
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- Pages.652-655
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- 2001
The study of laser processing parameter for $\mu$ -BGA cutting
$\mu$ -BGA 절단을 위한 레이저 가공 파라미터 연구
Abstract
In this paper, I have studied minimization of the kerf-width and surface burning which are occurred after the singulation process of multi layer