Organic Additives effect affected on the Property of Electrodeposited copper foil

전해동박의 특성에 미치는 유기 첨가제 효과

In this paper, the amount of additives in the electrode were investigated the relation of the mechanical properties and surface luminance of copper foil. Especially, organic compound of PEG(Poly-ethylene Glycol) was added from 1 to 20ppm for the propose of increasing the mechanical property and the surface state. The surface luminance of copper foil is appealed 69.25 at 2ppm-15A/$dm^2$ and 68.25 at 2ppm-10A/$dm^2$. It guess that 10ppm-10A/$dm^2$ occurred pin-hole. Tensile strength was not showed the significant difference but elongation appealed the most value at 5ppm-15A. We earned that the most PEG value of mechanical properties is 5 PPM.