한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2000년도 영호남학술대회 논문집
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- Pages.237-241
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- 2000
반도체 metallization용 Al-Cu 합금의 미세구조 천이에 미치는 Si 첨가영향
Effect of Si Addition on the Microstructure of AI-Cu-Si Alloy for Thin Film Metallization
- 박민우 (경성대학교 재료공학과)
- Park, Min-Woo (Department of Materials Engineering, Kyung Sung University)
- 발행 : 2000.05.13
초록
The effects of Si addition on the precipitation processes of in Al-Cu-Si alloy films were studied by the transmission electron microscopy. Deposition of an Al-1.5Cu-1.5Si (wt. %) film at
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