한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 2000년도 춘계학술대회 논문집
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- Pages.730-734
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- 2000
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- 2005-8446(pISSN)
3-D 칩 만곡의 굽힘응력에 관한 연구
A Study of Bending Stress for the 3-D Chip Curl
초록
Once the Chip has developed a mixed mode of side-curl and up-curl, it would generally curl to strike the too] flank. The development of the bending stresses and shear in the chip would ultimately lead to chip failure. This paper attacks this problem from a mechanics-based approach. by treating the chip as a 3-D elastic curved beam, and applying appropriate constraints and forces. The expressions for bending. shear and direct stresses are developed through an energy-based criterion. The location of the maximum stresses is also identified and explained for simulated test conditions.