Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 2000.06b
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- Pages.96-99
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- 2000
Electrical Characterization of BGA interconnection for RF packaging
Radio Frequency 회로 모듈 BGA 패키지
- Kim, Dong-Young (Department of Electronic Engineering, College of Engineering, Sogang University) ;
- Woo, Sang-Hyun (Department of Electronic Engineering, College of Engineering, Sogang University) ;
- Choi, Soon-Shin (Department of Electronic Engineering, College of Engineering, Sogang University) ;
- Jee, Yong (Department of Electronic Engineering, College of Engineering, Sogang University)
- Published : 2000.06.01
Abstract
We presents a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and examined electrical parameters with a HP5475A TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3
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