Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Electrical Characterization of BGA interconnection for RF packaging

Radio Frequency 회로 모듈 BGA 패키지

  • Kim, Dong-Young (Department of Electronic Engineering, College of Engineering, Sogang University) ;
  • Woo, Sang-Hyun (Department of Electronic Engineering, College of Engineering, Sogang University) ;
  • Choi, Soon-Shin (Department of Electronic Engineering, College of Engineering, Sogang University) ;
  • Jee, Yong (Department of Electronic Engineering, College of Engineering, Sogang University)
  • 김동영 (서강대학교 공과대학 전자공학과) ;
  • 우상현 (서강대학교 공과대학 전자공학과) ;
  • 최순신 (서강대학교 공과대학 전자공학과) ;
  • 지용 (서강대학교 공과대학 전자공학과)
  • Published : 2000.06.01
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Abstract

We presents a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and examined electrical parameters with a HP5475A TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3 $\times$ 3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, self inductance 146pH, mutual capacitance 10.9fF and mutual inductance 16.9pH. S parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55㎓ and the loss of 0.26dB. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

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