Proceedings of the Korean Society For Composite Materials Conference (한국복합재료학회:학술대회논문집)
- 2000.04a
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- Pages.175-183
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- 2000
Thermomechanical Analysis of Functionally Gradient Al-$SiC_{p}$ Composite for Electronic Packaging
전자패키지용 경사조성 Al-$SiC_{p}$ 복합재료의 열 . 기계적 변형특성 해석
Abstract
The internal residual stresses within the multilayered structure with shan interface induced by the difference in thermal expansion coefficient between the materials of adjacent layers often provide the source of failure such as delamination of interfaces and etc. Recent development of the multilayered structure with functionally graded interface would be the solution to prevent this kind of failure. However a systematic thermo-mechanical analysis is needed fur the customized structural design of multilayered structure. In this study, theoretical model for the thermo-mechanical analysis is developed for multilayered structures of the Al-
Keywords
- Al/$SiC_{p}$;
- FGM;
- Thermomechanical deformation;
- Curvature;
- Internal stress;
- Electronic packaging material;
- Multilayered structure design