Proceedings of the Korea Electromagnetic Engineering Society Conference (한국전자파학회:학술대회논문집)

The Korean Institute of Electromagnetic Engineering and Science (한국전자파학회)
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THE NOVEL SILICON MEMS PACKAGE FOR MMICs

초고주파 집적 회로를 위한 새로운 실리콘 MEMS 패키지

  • 권영수 (아주대학교 전자공학부) ;
  • 이해영 (아주대학교 전자공학부) ;
  • 박재영 (LG 전자기술원 소자재료연구소) ;
  • 부종욱 (LG 전자기술원 소자재료연구소)
  • Published : 2000.11.01
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Abstract

In this paper, we characterized a novel MEMS package using high resistivity silicon for microwave and millimeter-wave devices. The manufactured MEMS package shows -20dB of S$\sub$11/ and -0.4dB of S$\sub$21/ up to 200GHz. The new package can be a low cost and high performance solution due to process compatibility with on-chip devices and very small and precise dimensions by semiconduotor technology.

Keywords