Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.10a
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- Pages.105-129
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- 2000
Au-Au Flip Chip Mounting Technology by NEC
- Hino, Shigekazu (Advanced Assembly Technologies Development Group Semiconductor Div. NEC Kansai Ltd)
- Published : 2000.10.01
Abstract
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