한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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- Pages.81-86
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- 2000
Wettability Analysis of Liquid Phase in Partial Melted Solders Using Wetting Balance
- Park, J.Y. (School of Materials Science & Engineering, Seoul National University) ;
- Ha, J.S. (School of Materials Science & Engineering, Seoul National University) ;
- Kang, C.S. (School of Materials Science & Engineering, Seoul National University) ;
- Kim, M.I. (Department of Materials Science & Engineering, Univ. of Seoul) ;
- Shin, K.S. (Department of Materials Science & Engineering, Univ. of Seoul) ;
- Jung, J.P. (Department of Materials Science & Engineering, Univ. of Seoul)
- 발행 : 2000.04.01
초록
To evaluate the possibility of the partial melting soldering. wettability of partial melted solders was measured using wetting balance. Off eutectic Sn-Pb allows are wettable in their partial melting zone. Especially, Pb rich alloys showed excellent wettability while wettability of Sn rich alloys were adequate or poor. It is found that wettability increases over