Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.04a
- /
- Pages.80-80
- /
- 2000
New Fabrication Method of Solder Ball for Micro BGA package
- Ko, H-S. (Materials Science & Engineering Divisions) ;
- Chang, J-Y (Materials Science & Engineering Divisions) ;
- Yoo, M-K (Materials Science & Engineering Divisions) ;
- Moon, I-G (Materials Science & Engineering Divisions)
- Published : 2000.04.01
Abstract
Keywords