한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2000년도 하계학술대회 논문집
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- Pages.99-102
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- 2000
감광성 BCB를 사용한 다층 MCM-D 기판에서 비아홀 형성에 관한 연구
Study on Via hole formation in multi layer MCM-D substrate using photosensitive BCB
초록
Via for achieving reliable fabrication of MCM-D substrate was formed on the photosensitive BCB layer. MCM-D substrate consists of photosensitive BCB(Benzocyclobutene) interlayer dielectric and copper conductors. In order to form the vias in photosensitive BCB layer, the process of BCB and plasme etch using