Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 2000.11a
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- Pages.102-102
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- 2000
The Effect of Thermal Treatment on the Reliability of Electrochemical Deposition (ECD) Cu Films for Ultralarge-Scale Integration (ULSI) Multilevel Interconnect
ULSI에 적용될 전해증착 구리의 신뢰성에 미치는 열처리 효과
Abstract
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