Analyses of Micromachinning Processes for Microaccelecrometer Sensors Based on Electrostatic Forces

정전기력을 이용한 마이크로가속도계 센서의 마이크로머시닝 공정해석

Single crystal silicon (SCS) is used in a variety of microsensor applications in which stresses and other mechanical effects may dominate device performance. The authers model temperature dependent mechnical properties during focused io beam(FIB) cutting and Pt deposition processes. In microaccelero-meter manufacturing process, this paper intend to find thermal displacement change of the temperature by tunnel gap, additional beam part and pt deposition. The thermal analysis intend to use ANSYS V5.5.3.