Proceedings of the KIPE Conference (전력전자학회:학술대회논문집)
- 2000.07a
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- Pages.685-688
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- 2000
Pulse Rectifier For Electroplating
전기도금용 펄스 전원장치
Abstract
Pulse plating is about to deposit material at high current density compared to conventional DC plating. For example pulse plating can get more fine grain can improve adhension and metal distribution and current efficiency can reduce internal stress and crack. therefore we studied pulsed power supply which has high current density and improve deposition quality and increase plating speed in this paper.
Keywords