A Study on the Characteristic of the Inductively Coupled $SF_6$ Plasma

유도 결합형 $SF_6$플라즈마 특성에 관한연구

This paper represents the characteristic analysis for the etching in $SF_6$ plasma and the plasma itself, based on the specific knowledges on the discharge mechanism of $SF_6$ plasma which is widely used for the applications of dry etching, using Radio Frequency Inductively Coupled Plasma (RFICP) by measuring electron density, electron temperature then observing their relationship to find the effect of discharge mechanism of $SF_6$ plasma to the etching in contrast to the existing method of finding optimal discharge condition by heuristic.