Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Simultaneous Switching Noise Model in Multi-Layered IC Package System with Ground Plane

그라운드 평면을 갖는 다층 구조 IC 패키지 시스템에서 동시 스위칭 노이즈 모델링

  • 최진우 (한양대학교 전자공학과) ;
  • 어영선 (한양대학교 전자공학과)
  • Published : 1999.06.01
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Abstract

It is essential to estimate an effective inductance in a ground plane of muliti-layer IC package system in order to determine the simultaneous switching noise of the package. A new method to estimate the effective ground inductance in multi-layer IC package is presented. With the estimated ground plane inductance values, maximum switching noise variations according to the number of simultaneously switching drivers are investigated by developing a new SSN model. These results are verified by performing HSPICE simulation with the 0.35${\mu}{\textrm}{m}$ CMOS technology.

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