21C Korean Lithography Roadmap

  • Baik, Ki-Ho (Memory Research Division, Hyundai Electronics Industries Co., Ltd.) ;
  • Yim, Dong-Gyu (Memory Research Division, Hyundai Electronics Industries Co., Ltd.) ;
  • Kim, Young-Sik (Memory Research Division, Hyundai Electronics Industries Co., Ltd.)
  • Published : 1999.06.01

Abstract

As the semiconductor industry enters the next century, we are facing to the technological changes and challenges. Optical lithography has driven by the miniaturisation of semiconductor devices and has been accompanied by an increase in wafer productivity and performance through the reduction of the IC image geometries. In the last decade, DRAM(Dynamic Random Access Memories) have been quadrupoling in level of integration every two years. Korean chip makers have been produced the memory devices, mainly DRAM, which are the driving force of IC's(Integrated Circuits) development and are the technology indicator for advanced manufacturing. Therefore, Korean chip makers have an important position to predict and lead the patterning technology. In this paper, we will be discussed the limitations of the optical lithography, such as KrF and ArF. And, post optical lithography technology, such as E-beam lithography, EUV and E-beam Projection Lithography shall be introduced.

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