Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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The variations of AC dielectric breakdown strength of epoxy composites due to boiling absorption

비등흡수에 따른 에폭시 복합체의 교류 절연파괴강도의 변화

  • 이덕진 (광운대학교 전기공학과) ;
  • 김경민 (광운대학교 전기공학과) ;
  • 김탁용 (광운대학교 전기공학과) ;
  • 손인한 (신성대학교 전기과) ;
  • 신성권 (동해대학 정보통신과) ;
  • 김경환 (경원대학교 전기전자공학부) ;
  • 김재환 (광운대학교 전기공학과)
  • Published : 1999.05.01
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Abstract

In this Paper, the variable dielectric breakdown strengths of epoxy composites were investigated at belling absorption condition in order to observe the influences of moisture in out door use. Also. in order to improve withstand voltage properties at moisture absorbtion condition, IPN(interpenetrating polymer network) method was Introduced and the Influence was investigated. As Adding filler(SiO$_2$) classified by o(phr), 50(phr) and 100[phr] to two kinds of matrix resin, six kinds of specimens were manufactured. As a result, it was confirmed that dielectric breakdown strength wer degraded with boiling time and filer content increasing. But, it was confirmed that dielectric breakdown strength degrading rate were lowered by the Improvement of adhesion strength in IPN specimens.

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