한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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- Pages.211-213
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- 1999
STI-CMP 공정을 위한 Pattern wafer와 Blanket wafer 사이의 특성 연구
A study on Relationship between Pattern wafer and Blanket Wafer for STI-CMP
초록
In this paper, we documented the controlling oxide removal amount on the pattern wafer using removal rate and removal thickness of blanket wafer. There was the strong correlation relationship for both(correlation factor:0.7109). So, we could confirm the repeatability as applying for STI CMP process from the obtained linear formular. As the result of repeatability test, the difference of calculated polishing time and actual polishing time was 3.48 seconds based on total 50 lots. If this time is converted into the thickness, it is from 104
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