Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1999.11a
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- Pages.110-110
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- 1999
Adhesion Properties of Sn-3.5Ag, Sn-0.7Cu Lead-Free Alloy/Lead Frame Solder Joints
Sn-3.5Ag, Sn-0.7Cu 무연합금과 리드프레임간의 솔더 접합특성
Abstract
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