Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1999.11a
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- Pages.84-84
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- 1999
A study on CVD TaN as a diffusion barrier for Cu interconnects
구리 배선공정에서의 CVD TaN 확산방지막에 관한 연구
- Im, Se-Joon (School of Materials Science and Engineering, Seoul National University) ;
- Kim, Soo-Hyun (School of Materials Science and Engineering, Seoul National University) ;
- Park, Ki-Chul (Samsung Electronics Co. Ltd.) ;
- Cho, Sung-Rae (School of Materials Science and Engineering, Seoul National University) ;
- Kim, Ki-Bum (School of Materials Science and Engineering, Seoul National University)
- Published : 1999.11.01
Abstract
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