Proceedings of the Korean Powder Metallurgy Institute Conference (한국분말야금학회:학술대회논문집)
- 1998.04b
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- Pages.29-29
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- 1998
Fabrication and Characterization of SiCp/Al Metal Matrix Composites for Electronic Packaging Applications
전자패키징용 SiCp/Al 금속복합재료의 제조 및 특성평가
Abstract
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