Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1998.08a
- /
- Pages.99.3-99
- /
- 1998
SELF-ALIGNED FABRICATION OF SILICON V-GROOVE AND FLIP-CHIP SOLDER BUMP PADS USING METAL PROTECT10N METHODS DURING KOH SILICON ETCHING
- Lee, S.H. (Semiconductor Division, ETRI) ;
- Joo, G.C. (Semiconductor Division, ETRI) ;
- Park, K.S. (Semiconductor Division, ETRI) ;
- Song, M.K. (Semiconductor Division, ETRI) ;
- Kim, H.M. (Semiconductor Division, ETRI) ;
- Pyun, K.E. (Semiconductor Division, ETRI)
- Published : 1998.08.01
Abstract
Keywords