Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1998.08a
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- Pages.98.4-98
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- 1998
CHIP ARRAY BGA PACKAGE PROCESS CHARACTERIZATION
- Cha, S.S. (New Package Development Department, Anam Semiconductor Inc.) ;
- Oh, K.S. (New Package Development Department, Anam Semiconductor inc.) ;
- Min, B.Y. (New Package Development Department, Anam Semiconductor Inc.) ;
- Panczak, T. (New Package Development Department, Anam Semiconductor Inc.)
- Published : 1998.08.01
Abstract
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