한국재료학회:학술대회논문집 (Proceedings of the Materials Research Society of Korea Conference)
- 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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- Pages.97.4-97
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- 1998
Bumping, CSPs and Substrates; The new Packaging Materials and Technologies,
- Lee, Y.M. (Micro Systems, Semiconductor Tech. Division, ETRI) ;
- Park, H.O. (Micro Systems, Semiconductor Tech. Division, ETRI) ;
- Ju, C.W. (Micro Systems, Semiconductor Tech. Division, ETRI) ;
- Lee, S.B. (Micro Systems, Semiconductor Tech. Division, ETRI) ;
- Baek, J, T. (Micro Systems, Semiconductor Tech. Division, ETRI) ;
- Kim, B.W. (Micro Systems, Semiconductor Tech. Division, ETRI)
- 발행 : 1998.08.01