Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1998.08a
- /
- Pages.139.4-139
- /
- 1998
EFFECTS OF TEMPERATURE AND pH OF PLATING SOLUTION ON Ni/Au BUMP FORMATION FOR FLIP CHIP INTERCONNECTION
- Jeon, Seong-Ho (Division of Materials Science and Eng., Hanyang Univ.) ;
- Park, Jong-Wan (Division of Materials Science and Eng., Hanyang Univ.)
- Published : 1998.08.01
Abstract
Keywords