Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1998.08a
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- Pages.73-73
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- 1998
THE INFLUENCE OF PEEL STRENGTH BETWEEN UBM LAYERS AND POLYIMIDE ON THE SHEAR STRENGTH OF SOLDER BUMPS
- S. J. Heo (Dept. of Mat. Eng., Hanyang Univ) ;
- Kim, Y.-H. (Dept. of Mat. Eng., Hanyang Univ) ;
- B. J. Han (Anam Semiconductor Co Ltd., Seoul) ;
- J. H. Yoon (Anam Semiconductor Co Ltd., Seoul)
- Published : 1998.08.01
Abstract
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