Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1998.11a
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- Pages.135-135
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- 1998
Characteristics of copper electrodeposits and micro-pattern filling by pulsed current and periodic reverse current
Pulsed current와 periodic reverse current를 통한 구리전착층 및 미세패턴 충전 특성
Abstract
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