Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1998.11a
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- Pages.81-81
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- 1998
Flip Chip Assembly on Board using Anisotropic Conductive Film and Electroless Ni/Au Bumps
이방성 도전 필름과 무전해 니켈/금 범프를 이용한 플립칩 공정에 관한 연구
- Yim, Myung-Jin (Dept. of Mat. Sci. & Eng, KAIST) ;
- Paik, Kyung-Wook (Dept. of Mat. Sci. & Eng, KAIST)
- Published : 1998.11.01
Abstract
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