Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1998.11a
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- Pages.80-80
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- 1998
Characterization of Ni/Au electroless plating and Sn/Pb electroplating for advanced flip chip package application
차세대 flip chip 패키지 응용을 위한 Ni/Au 무전해도금 및 Sn/Pb 전기도금 특성
Abstract
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