Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1998.11a
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- Pages.34-34
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- 1998
Thermal Stability of the Interface between TaN Deposited by MOCVD and Electroless-plated Cu Film
MOCVD 방법으로 증착된 TaN와 무전해도금된 Cu 박막 계면의 열적안정성 연구
Abstract
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