대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)
- 대한전자공학회 1998년도 추계종합학술대회 논문집
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- Pages.1141-1144
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- 1998
CMOS IC 패키지의 스위치 특성 해석 및 최적설계
A New CMOS IC Package Design Methodology Based on the Analysis of Switching Characteristics
초록
A new design methodology for the shortchannel CMOS IC-package is presented. It is developed by representing the package inductance with an effective lumpedinductance. The worst case maximum-simultaneous-switching noise (SSN) and gate propagation delay due to the package are modeled in terms of driver geometry, the maximum number of simultaneous switching drivers, and the effective inductance. The SSN variations according to load capacitances are investigated with this model. The package design techniques based on the proposed guidelines are verified by performing HSPICE simulations with the
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