대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)
- 대한전자공학회 1998년도 추계종합학술대회 논문집
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- Pages.1053-1056
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- 1998
RF 패키지 특성화 및 등가 회로 모델
RF Package Characterization and Equivalent Circuit Model
초록
Package strutures for RF circuit design are characterized and their equivalent circuitsare developed. The circuit parameters are extracted by using the commercial 3-dimensional field solver. The circuit models are verified by using the full-wave analysis in the RF region. It is demonstarted with the developed circuit models that the packages have substantial effects on the RF circuit performances.
키워드