Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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A study on $YBa_2Cu_3O_x$ thick films by diffusion process for a superconducting fault current limiter

확산법을 이용한 사고전류제한기용 $YBa_2Cu_3O_x$ 후막연구

  • Cho, Dong-Eon (Dept. of Electrical Eng., Chonbuk National University) ;
  • Yim, Seong-Woo (Dept. of Electrical Eng., Chonbuk National University) ;
  • Choi, Myung-Ho (Dept. of Electrical Eng., Chonbuk National University) ;
  • Han, Byoung-Sung (Dept. of Electrical Eng., Chonbuk National University)
  • Published : 1998.07.20
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Abstract

$YBa_2Cu_3O_x$(Yl23) Superconducting thick films on $Y_2BaCuO_5$(Y211) substrate were Prepared by surface diffusion process between $BaCuO_2$+CuO composite coating powder and a Y2ll substrate. X-ray diffraction shows that the Yl23 layer onto Y2ll substrate is the orthorhombic crystal structure. The specimen heated at $940^{\circ}C$ for 2h showed the maximum $J_c$ fo 500A/$cm^2$. Based on optimal condition, the superconducting fault current limiter(FCL) having a current limiting area 1mm wide and 66mm long was fabricated on Y211 substrate. A typical current limiting waveform was measured. When a voltage of 3V was applied, the fault current with a peak of 15A was limited to about 0.11A.

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